Our Services
Our services span engineering design to reverse engineering, package assembly to testing, and qualification to reliability. We refine intricate semiconductor technologies into nimble and effective alternatives.
Engineering Design
Circuit Design
Crafting a detailed schematic to arrange and intricately interconnect components for specific electronic functionality.
Schematic Design
Creating a simplified, standardized visual representation of electronic circuit interconnections and components.
System-On-Chip Design
Consolidating various electronic functionalities onto a single semiconductor substrate enhances integration for advanced power systems.
Integrated Circuit Design
Strategically positioning power electronic components on a semiconductor substrate to construct a refined, operational, and space-efficient power circuit.
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Reverse Engineering
Decapsulation
Unveiling the gallium oxide substrate of power electronic components by extracting them from their protective encapsulation for subsequent analysis.
Functional Analysis
Understanding how data is processed and flows through a power electronic component's circuitry reveals its operational logic and purpose.
Reverse Synthesis
Understanding how power is processed and flows through a power electronic component's circuitry unveils its operational logic and purpose.
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Package Assembly
Die Attachment
Utilizing a soldering compound in power electronic components secures the bonding of a gallium oxide epitaxial layer to a substrate or lead frame.
Bonding Process
Initiate the bonding procedure by thermally activating the assembly to instigate the chemical reaction of the bonding agent, applying tailored mechanical force to optimize interfacial adhesion between the gallium oxide epitaxial layer and the substrate.
Lead Formation
Shaping and configuring the leads or pins on power electronic components facilitates easy integration and connection with external circuits on a circuit board.
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Testing
Radiation Testing
Testing encompasses subjecting these devices to diverse radiation sources to evaluate their operational robustness and reliability in radiation-rich environments.
Wafer Testing
ATE assesses the electrical attributes of individual electronic components on a wafer before disjunction and encapsulation.
Burn-In Testing
Devices undergo accelerated testing in demanding conditions to unveil latent defects, fortifying electronic components' long-term reliability and stability.
Scanning Electron Microscopy (SEM)
High-resolution imaging is used for detailed analysis of the physical structure of electronic components, helping identify defects at the microscopic level.
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Qualification
Design Qualification
Evaluate the design compliance with specifications and requirements.
Operational Qualification
Verify that the equipment operates according to specifications.
Performance Qualification
Conduct tests under normal operating conditions, analyze results, and assess reliability.
Product Qualification
Execute extensive testing of manufactured devices, ensuring they meet quality and performance standards.
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Reliability
Design for Reliability (DFR)
Evaluate potential failure modes, assess stress factors, and implement design features to enhance reliability.
Accelerated Life Testing (ALT)
Subject devices to elevated temperatures, voltage, and stress levels to accelerate aging and assess long-term reliability.
Failure Analysis
Analyze failed devices using techniques like microscopy and spectroscopy to identify failure mechanisms.
Field Reliability Monitoring
Analyze data from devices deployed in the field to validate and improve reliability models.
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| NAICS Code | Industry |
|---|---|
| 334413 | Semiconductor And Related Device Manufacturing |
| 334419 | Other Electronic Component Manufacturing |
| 334517 | Irradiation Apparatus Manufacturing |
| 335999 | All Other Miscellaneous Electrical Equipment and Component Manufacturing |
| 541330 | Engineering Services |
| 541713 | Research And Development In Nanotechnology |
| 541715 | Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) |